Analyzing Precision Step Height and Semiconductor Wafer Thickness
• For semiconductor wafer thickness and step height analysis, EUROCALTECH employs cutting-edge technology.
• Key elements in the semiconductor sector.
The thickness of semiconductor wafers measured by laser.
• Computer-controlled selection of wavelength and angle of incidence is a characteristic of the VASE® variable-angle spectroscopic ellipsometer.
• Light is supplied from UV to NIR by the Xenon lamp.
• 193 nm to 1700 nm are covered by stacked Si/InGaAs detectors.
• AutoRetarderTM is used by VASE® in a rotating analyzer ellipsometer setup.